Power Packaging: Innovation And Improvement

Market research & strategy counseling Yole Développement has assembled an idealistic investigation of the power electronics industry which shows how power packaging advancement is reshaping the store network.

The power device market is relied upon to see an agreeable 13.9 percent development somewhere in the range of 2018 and 2019, contrasted with 2017. This is the second continuous high-development year in this industry, following a few level years. As a key component in control converters and inverters, the module market should reach about $6 billion by 2024 with 6.6 percent CAGR somewhere in the range of 2018 and 2024.

In its most recent report, ‘Status of the Power Module Packaging Industry’, Yole says that moreover, the packaging market for control modules will be worth $2.2 billion by 20214. The EV/HEV area is a significant driver just like the utilization of SiC and GaN innovations.

“Power module packaging is clearly a very dynamic market with constantly reshaping supply chain”, remarks Milan Rosina, head analyst, Power Electronics and Batteries, at Yole. “Continuous innovations, materials’ enhancements, lot of R&D investments are part of the today’s power module landscape.”

“In the past, packaging needs were driven by industrial applications, but today the market has changed and future will be different”, reports Shalu Agarwal, power electronics and materials investigator at Yole.”Indeed, EV/HEV will be the main player. At Yole, we think, EV/HEV will become the biggest power module market by 2024 and will represent a $2.5 billion market in value”.

This present market’s promising standpoint proposed by the power electronics group at Yole, is unmistakably useful for the power module bundling material business. Along these lines, the power module packaging material market will accomplish a 7.8 percent CAGR somewhere in the range of 2018 and 2024, coming to the $2.2 billion business opportunity by 2024. Under this dynamic setting, the material division will speak to more than 33% of the power module showcase.

Yole’s report takes a gander at substrates, baseplates, kick the bucket join, substrate connect, embodiment, interconnections, and TIM markets.

In 2018 the biggest bundling material portion was baseplates, trailed by substrates. The other 32 percent was spoken to by bite the dust join and substrate-connect materials. In this way, major mechanical decisions in these portions can quickly affect the general power module bundling market. For instance, the piece of the overall industry for silver sintering as a pass on append is expanding, driven particularly by EV/HEV. This innovation is pricier than increasingly regular patching materials, and CAGR for the pass on join market is +10.8 percent somewhere in the range of 2018 and 2024 – well higher than for other market portions.

The second-most elevated development is for interconnections. Yole’s examiners report 8.7 percent CAGR for the 2018 – 2024 period. This market section is trailed by substrates, with a 2018 – 2024 CAGR of 8.5 percent.

System Plus Consulting, sister company of Yole additionally works together with Yole’s experts to recognize and look at the present power module packaging advancements. Its report, Automotive Power Module Packaging Comparison, stands up to structures and expenses of arrangements today conveyed by key car providers. System Plus Consulting’ examiners bring up the distinctive specialized decisions chose by these companies.

“EV/HEVs progress pushes the electronic systems to meet new requirements to improve performance and reliability”, declares Elena Barbarini, head of office devices at System Plus Consulting. “Since the early stages of car electrification, power modules have been playing a key role, especially in the optimisation of performances from inverters to bi-directional converters.”

Packaging these modules is today basic because of a few specialized angles, for example, warm efficiency and system combination. Also, cost sway on the last arrangement turns out to be increasingly stringent and lot of power electronics companies meets a few issues to stay focused in the open market.

Barbarini includes: “Power electronics companies offer various innovative solutions, from integrated heatsink to die attach, for both discretes and modules. Moreover the request of cost saving during the integration steps pushes design companies to move forward single and more flexible structures, such as 1-in-1commutation cells or embedded discretes.”

As an immediate outcome, the power module packaging production network is indicating solid changes. Without a doubt, two fundamental variables will affect its reshaping in the coming years. Yole reports, the development of packaging advancements, and the EV/HEV industry’s particular necessities:

The development of packaging advances such aslow-inductance interconnections, silver-sintering pass on connect material, Si3N4 AMB artistic substrates, will profit the providers offering these solutions. For instance: MacDermid Alpha, Rogers, and Toshiba Materials.

Other than the materials providers, packaging hardware producers (for example wire bonders, sintering machines, reflow stoves, cleaning gear) will likewise be decidedly or contrarily affected by these changes. The power module creators that embrace inventive bundling arrangements right off the bat can verify a superior market position, as found in the case of STMicroelectronics’ SiC control module utilized in the Tesla Model 3’s fundamental inverter.

Yole says that providers of packaging answers for EV/HEV power modules must adjust their procedure, item portfolio, and assembling abilities to fulfill solid prerequisites as far as costs, made volume, and item unwavering quality.

This is a difficult assignment, particularly in light of the fact that numerous players are focusing on circumstances offered by means of quickly developing EV/HEV request. To prevail in this aggressive condition, new mergers and acquisitions just as associations are important to help catch new innovations/new clients rapidly, and increment generation limit. To diminish cost pressure, a few companies have just moved or are intending to move at any rate some portion of their creation ability to nations with lower generation costs (for example China, Romania, and Vietnam).

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