Tags: 12-Layer 3D-TSV Chip

Samsung Electronics Expand Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

A world leader in advanced semiconductor innovation, today reported that it has built up the industry’ initial 12-layer 3D-TSV (Through Silicon Via) innovation. Cross-segment of 8-layer versus Samsung’s new 12-layer 3D-TSV Chip Packaging structure (Graphic: Business Wire) Samsung’s new development is viewed as one of the most testing bundling advancements for large scale manufacturing of…