Tags: Samsung Electronics

Samsung Electronics Expand Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

A world leader in advanced semiconductor innovation, today reported that it has built up the industry’ initial 12-layer 3D-TSV (Through Silicon Via) innovation. Cross-segment of 8-layer versus Samsung’s new 12-layer 3D-TSV Chip Packaging structure (Graphic: Business Wire) Samsung’s new development is viewed as one of the most testing bundling advancements for large scale manufacturing of…

Samsung Electronics to reinstate plastic packaging with sustainable materials

Samsung Electronics Co., Ltd. announced that the company will begin making strides this year to supplant plastic bundling materials with paper and other naturally economical components. From the first half of 2019, the packaging utilized as of now for Samsung’s products and adornments – running from cell phones and tablets to home appliances – will…