Tags: Samsung

Samsung Electronics Expand Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

A world leader in advanced semiconductor innovation, today reported that it has built up the industry’ initial 12-layer 3D-TSV (Through Silicon Via) innovation. Cross-segment of 8-layer versus Samsung’s new 12-layer 3D-TSV Chip Packaging structure (Graphic: Business Wire) Samsung’s new development is viewed as one of the most testing bundling advancements for large scale manufacturing of…

Samsung utilizes green packaging for the Galaxy S10 line

Samsung discharged an infographic today related with the environmentally friendly packaging it is utilizing for the Samsung Galaxy S10 line. Rather than plastics and vinyls, the company utilizes “environmentally sustainable materials.” It likewise overhauled the packaging; previously, Samsung utilized a sleeve to cover the whole box, included a holder plate and a base box. The…